| 摘要 |
Size reduction of an image pickup module is promoted, and reliability of electric connection and electric noise resistance are improved by decreasing the numbers of components and connection spots. The problems are solved by providing an image pickup module including a solid-state image pickup element chip having an image pickup surface, a cover glass that covers the image pickup surface, and a wiring board on which the solid-state image pickup element chip is mounted, in which the solid-state image pickup element chip and the wiring board have an overlap structure in which end portions thereof are overlapped with each other, and a first electrode portion formed on the end portion of the solid-state image pickup element chip and a second electrode portion formed on the end portion of the wiring board are electrically connected through a bump.
|
