发明名称 |
Wire loop, semiconductor device having same and wire bonding method |
摘要 |
A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.
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申请公布号 |
US8016182(B2) |
申请公布日期 |
2011.09.13 |
申请号 |
US20050125924 |
申请日期 |
2005.05.10 |
申请人 |
KAIJO CORPORATION |
发明人 |
SHIRATO MIZUHO;FUJISAWA HIROMI;AKITA TADAHISA |
分类号 |
B23K1/06;B23K20/10 |
主分类号 |
B23K1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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