发明名称 SENSOR DEVICE, METHOD OF MANUFACTURING SENSOR DEVICE, MOTION SENSOR, AND METHOD OF MANUFACTURING MOTION SENSOR
摘要 A sensor device includes: a silicon substrate; a first electrode provided at an active surface side of the silicon substrate; an external connection terminal provided at the active surface side so as to be electrically connected to the first electrode; a stress relief layer provided between the silicon substrate and the external connection terminal; and a vibrating gyro element as a sensor element including a extraction electrode. The vibrating gyro element is held to the silicon substrate by connection between the extraction electrode and the external connection terminal.
申请公布号 US2011210408(A1) 申请公布日期 2011.09.01
申请号 US201113037981 申请日期 2011.03.01
申请人 SEIKO EPSON CORPORATION 发明人 OTSUKI TETSUYA
分类号 H01L29/84;H01L21/02 主分类号 H01L29/84
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