| 摘要 |
PURPOSE: A light emitting device, a light emitting device manufacturing method, and a light emitting device package are provided to form a dielectric layer between a first electrode and a second electrode, thereby preventing a light emitting device from being damaged due to static electricity. CONSTITUTION: A light emitting structure(110) includes a first conductive semiconductor layer(112), an active layer(114), and a second conductive semiconductor layer(116). A part of the first conductive semiconductor layer is exposed. A dielectric layer(130) is formed on the exposed part and the second conductive semiconductor layer. A first electrode(142) contacts the dielectric layer. The first electrode is arranged on an exposed surface of the first conductive semiconductor layer. A second electrode(146) is formed on the second conductive semiconductor layer. |
