| 摘要 |
PURPOSE: A method of a semiconductor package is provided to stabilize the electrical connection between a substrate and a semiconductor chip by suppressing the misalignment of a bonding pad and the bond finger of a substrate. CONSTITUTION: In a method of a semiconductor package, a via hole(H) passing through a substrate is formed within the substrate(100). A conductive material(110) is formed within the via hole. An adhesive(120) is coated on the surface of the substrate in which the conductive material is formed. A semiconductor chip(130) having a bonding pad(140) which is arranged at the upper part of the conductive material is attached to the substrate. The bottom of the conductive material is pressed by a pin(150) to contact the conductive material with the bond pad of the semiconductor chip.
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