Method of forming a via and method of fabricating chip stack package thereof

摘要

PURPOSE: A method for forming a via and a method for manufacturing a stack chip package using the same are provided to supply a solution with metal particles to a via hole to process a substrate at a lower temperature, thereby quickly and simply forming a via. CONSTITUTION: A via hole(103) is formed in a substrate(102). The substrate is dipped in a first solution(30) so that the via hole is filled with the first solution. A second solution(32) with a metal particle is provided to the first solution so that the metal particle is sunken in the via hole. The substrate with the via hole is processed by heat. A via is formed in the via hole.