发明名称 WIRED-CIRCUIT-BOARD ASSEMBLY SHEET AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wired-circuit-board assembly sheet for reducing a production cost by improving the yield with a simple configuration, and also to provide a method of manufacturing the same. <P>SOLUTION: A plurality of suspension boards 2 with circuits are arranged in parallel in a horizontal direction. A plurality of units 5 are formed, so as to omit the suspension boards 2 with circuits at given intervals, and to be defined by margin portions 4 where the suspension boards 2 with circuits are omitted. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011066147(A) 申请公布日期 2011.03.31
申请号 JP20090214764 申请日期 2009.09.16
申请人 NITTO DENKO CORP 发明人 UMETANI EIHIRO;KONDO YOSHIHIKO;TANABE HIROYUKI
分类号 H05K1/02;G11B5/60;G11B21/21;H05K3/00;H05K3/06 主分类号 H05K1/02
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