| 摘要 |
PROBLEM TO BE SOLVED: To improve flexural modulus and flexural strength of a cured product of a liquid thermosetting resin composition used for production of a copper-clad laminate etc. SOLUTION: The liquid thermosetting resin composition contains (A) a cyanate ester compound that has two or more cyanate ester groups in one molecule, (B) a radically polymerizable compound that has two or more unsaturated double bonds in one molecule and has no hydroxyl group in the molecule while having a ring structure formed from only carbon and hydrogen in the molecule, (C) an epoxy resin that has two or more epoxy groups in one molecule, and (D) a radical polymerization initiator. The radically polymerizable compound (B) is a vinyl ester resin, and a content thereof is 10-70 mass% of the total amount of the cyanate ester compound (A), the radically polymerizable compound (B), and the epoxy resin (C). COPYRIGHT: (C)2011,JPO&INPIT |
