| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an adhesive sheet for multilayer wiring board for mounting semiconductor element, which can cleanly and efficiently manufacture the adhesive sheet having a hole and cavity, with which conductive paste used for bonding a base wiring board and a perforated wiring board having cavity for mounting semiconductor element is filled, and to provide a manufacturing method of the multilayer wiring board for mounting the semiconductor element, which uses the adhesive sheet obtained by the method. SOLUTION: The manufacturing method of the adhesive sheet performs (1) a process for preparing a sheet-like adhesion material, (2) a process for performing cavity work on the sheet-like adhesion material, (3) a process for bonding a releasing film to at least one side of the sheet-like adhesion material, (4) a process for forming a conductive paste filling hole in the sheet-like adhesion material and (5) a process for filling the conductive paste filling hole with the conductive paste in this order. COPYRIGHT: (C)2011,JPO&INPIT |
