| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer semiconductor device for suppressing the occurrence of connection failures among semiconductor devices.SOLUTION: The multilayer semiconductor device 10 includes a first semiconductor device 20 and a second semiconductor device 30. The first semiconductor device 20 includes first solder balls 27, 27, and so on and is electrically connected to the second semiconductor device 30 via the first solder balls 27, 27, and so on. The second semiconductor device 30 includes second solder balls 37, 37, and so on and is electrically connected to a substrate 1 via the second solder balls 37, 37, and so on. The composition of each first solder ball 27 differs from that of the second solder ball 37. |
