发明名称 LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THE SAME
摘要 PURPOSE: A light emitting device package and a manufacturing method thereof are provided to reduce the size of a product by not requiring an electrode layer and an insulation layer for connecting a metal case with a light emitting device. CONSTITUTION: A light emitting device(40) is prepared on a first metal base(10a). A second metal base is adhered to an adhesion member(20). The first metal base is separated from the second metal base to electrically connect the electrode of the light emitting device.
申请公布号 KR20100103241(A) 申请公布日期 2010.09.27
申请号 KR20090021767 申请日期 2009.03.13
申请人 AN, BOK MAN 发明人 AN, BOK MAN
分类号 H01L33/64 主分类号 H01L33/64
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