SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method of manufacturing the same are provided to easily and electrically connect the bumps of laminated semiconductor chip. CONSTITUTION: A semiconductor chip(10) comprises a penetrating electrode(5) passing through a semiconductor chip body(3). The semiconductor chip body comprises a top surface(1) and a bottom surface(2) facing the top surface. A bump(20) is arranged on one or more of end of the penetrating electrode.