发明名称 METHOD OF MAKING A HEAT SINK
摘要 PURPOSE: A method of making a heat sink is provide to reduce a manufacturing costs there is no soldering tin and fastening a blot. CONSTITUTION: The first heat conducting plate(1) comprises a plurality of first protrusions(10) and paths. A second heat conducting plate(2) comprises a plurality of second protrusions(21). A pin array assembly(3) has a plurality of plates. The first heat conducting plate is over lapped with the pin array assembly. Each plate of the pin array assembly is attached to a wide side of a first protrusion. A second heat conducting plate is overlapped with the first heat conducting plate. The second protrusion is corresponded to a path corresponding to the first heat conducting plate.
申请公布号 KR20100091868(A) 申请公布日期 2010.08.19
申请号 KR20090039094 申请日期 2009.05.06
申请人 GIGA-BYTE TECHNOLOGY CO., LTD. 发明人 HUANG SHUN CHIH;MAO TAI CHUAN
分类号 H05K7/20;G06F1/20;H01L23/34 主分类号 H05K7/20
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