发明名称 |
METHOD OF MAKING A HEAT SINK |
摘要 |
PURPOSE: A method of making a heat sink is provide to reduce a manufacturing costs there is no soldering tin and fastening a blot. CONSTITUTION: The first heat conducting plate(1) comprises a plurality of first protrusions(10) and paths. A second heat conducting plate(2) comprises a plurality of second protrusions(21). A pin array assembly(3) has a plurality of plates. The first heat conducting plate is over lapped with the pin array assembly. Each plate of the pin array assembly is attached to a wide side of a first protrusion. A second heat conducting plate is overlapped with the first heat conducting plate. The second protrusion is corresponded to a path corresponding to the first heat conducting plate.
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申请公布号 |
KR20100091868(A) |
申请公布日期 |
2010.08.19 |
申请号 |
KR20090039094 |
申请日期 |
2009.05.06 |
申请人 |
GIGA-BYTE TECHNOLOGY CO., LTD. |
发明人 |
HUANG SHUN CHIH;MAO TAI CHUAN |
分类号 |
H05K7/20;G06F1/20;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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