| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling apparatus for improved cooling efficiency by improving adhesion between a cooling pipe and a semiconductor module. Ž<P>SOLUTION: A semiconductor module 2 is provided which is heated by carring-current. A cooling pipe 3 is provided which contacts to the semiconductor module 2 for cooling the semiconductor module 2 using a coolant 4 that flows inside. The semiconductor module 2 and the cooling pipe 3 are alternately stacked by a plurality of numbers. In the cooling pipe 3, an inside layer 5 that contacts to the coolant 4 and outside layer 6 that contacts to the semiconductor module 2 are stacked, having a bimetal structure with the thermal expansion coefficient of the side layer 6 being larger than that of the inside layer 5. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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