| 摘要 |
PURPOSE: A method and an apparatus for manufacturing a semiconductor device are provided to improve a gap-fill property by rotating a chemical solution in an opposite direction to a rotation direction of a wafer. CONSTITUTION: A wafer with a via hole is immersed in chemical solutions including a metal element(40). A metal plug is formed by filing the metal elements in the via hole with electroplating while rotating the wafer in a first direction(42). The chemical solution rotates in a second direction opposite to the first direction(44). A metal element is copper. The rotation speed of the wafer is over the critical speed which induces pressure difference between the inside and the inlet of the via hole. The rotation speed of the chemical solution is set to increase the pressure difference between the inside and the inlet of the via hole.
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