发明名称 WIRING BOARD, PACKAGE FOR SEMICONDUCTOR ELEMENT STORAGE, AND SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board which has excellent termination characteristics even in a high frequency band of≥20 GHz and on which a mounted semiconductor element operates normally. <P>SOLUTION: The wiring board 8 includes a signal line conductor 2 on one principal surface of a dielectric substrate 1, a first grounding conductor 3 arranged on both sides thereof at intervals, a second grounding conductor 3a connected to the first grounding conductor 3 and arranged on the other principal surface of the dielectric substrate 1, a resistor 4 connecting one end of the signal line conductor 2 to the first grounding conductor 3, a bias terminal electrode 5 insulated from the first ground conductor 3, a bias conductor 6, in the dielectric substrate 1, which has one end connected to one end of the signal line conductor 2 and the other end connected to the bias terminal electrode 5 through a through conductor 6a respectively, and a radio wave absorber 7 connected to the bias conductor 6 along the length. Even when the signal line conductor 2 and bias conductor 6 are electromagnetically coupled to each other, attenuation by the radio wave absorber 7 is caused and reflection to the signal line conductor 2 is small, thereby obtaining the excellent termination characteristics. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010129647(A) 申请公布日期 2010.06.10
申请号 JP20080300727 申请日期 2008.11.26
申请人 KYOCERA CORP 发明人 IINO MICHINOBU;YOSHIHARA JUNKO
分类号 H01L23/14;H01L23/02;H01L23/06;H01L23/12 主分类号 H01L23/14
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