发明名称 ADHESIVE BONDING SHEET
摘要 Disclosed is an adhesive bonding sheet comprising a light-transmitting supporting base and an adhesive bonding layer which can be used in both the dicing step and the semiconductor device bonding step. The adhesive bonding layer contains a high- molecular-weight component containing a functional group which has a weight average molecular weight of not less than 100,000; an epoxy resin; a phenol epoxy resin curing agent; a photoreactive monomer whose cured product obtained by being irradiated with ultraviolet light has a Tg of not less than 250°C; and a photoinitiator which generates bases and radicals when irradiated with ultraviolet light having a wavelength of 200-450 nm.
申请公布号 KR20100060002(A) 申请公布日期 2010.06.04
申请号 KR20107008843 申请日期 2005.05.17
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 OOKUBO KEISUKE;INADA TEIICHI
分类号 H01L21/50;C08G59/18;C08L63/00;C09J4/00;C09J7/02;C09J133/06;C09J133/14;C09J163/00;H01L21/00;H01L21/301;H01L21/52;H01L21/58;H01L21/68 主分类号 H01L21/50
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