发明名称 |
ADHESIVE BONDING SHEET |
摘要 |
Disclosed is an adhesive bonding sheet comprising a light-transmitting supporting base and an adhesive bonding layer which can be used in both the dicing step and the semiconductor device bonding step. The adhesive bonding layer contains a high- molecular-weight component containing a functional group which has a weight average molecular weight of not less than 100,000; an epoxy resin; a phenol epoxy resin curing agent; a photoreactive monomer whose cured product obtained by being irradiated with ultraviolet light has a Tg of not less than 250°C; and a photoinitiator which generates bases and radicals when irradiated with ultraviolet light having a wavelength of 200-450 nm. |
申请公布号 |
KR20100060002(A) |
申请公布日期 |
2010.06.04 |
申请号 |
KR20107008843 |
申请日期 |
2005.05.17 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
OOKUBO KEISUKE;INADA TEIICHI |
分类号 |
H01L21/50;C08G59/18;C08L63/00;C09J4/00;C09J7/02;C09J133/06;C09J133/14;C09J163/00;H01L21/00;H01L21/301;H01L21/52;H01L21/58;H01L21/68 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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