Microstructure fluid cooler for e.g. CPU of personal computer, has base plate and intermediate levels produced by etching process, where material strength and remaining base thickness utilized by etching process amounts to specific values

摘要

The cooler has inlet- and discharge connections provided in a cover, and a base plate comprising a pin structure (3) for centrically absorbing heat. The base plate and intermediate levels are produced by an etching process, and a reservoir (2) is provided for optimal flow of main stream. Eight through-holes (1) are provided for attachment of the base plate to the cover, and an O-ring lies between the through-holes and reservoir. Material strength utilized by the etching process amounts to less than 3 mm, and remaining base thickness utilized by the etching process amounts to less than 0.5 mm.