| 摘要 |
Provided are an electronic component wherein each piece of element can be efficiently separated from a collective substrate, and a method for manufacturing the electronic component. On the collective substrate, (a) a conductive layer (10) which includes electrodes (12a, 12b, 14a, 14b, 16a, 16b) and pads (12s, 12t, 14s, 14t, 16s, 16t) of a plurality of elements, (b) an insulating layer which covers a part of the conductive layer (10) and has pad openings surrounding the circumferences of the pads (12s, 12t, 14s, 14t, 16s, 16t) by leaving at least the center sections of the pads, and (c) power feeding lines (22-28) which connect between the pads of the adjacent elements are formed. A plating layer is formed inside the pad openings by electroplating by carrying a current in the power feeding lines (22-28), then, an external terminal is formed on the plating layer. The collective substrate is cut into pieces of elements. On each of the cut element pieces, cut surfaces of the power feeding lines are formed being spaced apart from each other. |
