发明名称 Heat sink assembly
摘要 A heat sink assembly includes a base, a fin group located above a top of the base, a mounting bracket, and a fan mounted on a lateral side of the mounting bracket. The mounting bracket is integrally formed by a metal sheet. The mounting bracket includes a pedestal is located at a top of the base and connects with the base, and two sidewalls extending upwardly from opposite ends of the pedestal and sandwiching the fin group therebetween. The fan is mounted on a lateral side of the sidewalls of the mounting bracket. The pedestal integrally forms four mounting arms. Four fasteners extend through the mounting arms for securing the heat sink assembly to a printed circuit board.
申请公布号 US7701718(B2) 申请公布日期 2010.04.20
申请号 US20080235611 申请日期 2008.09.23
申请人 FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. 发明人 YU JIAN-PING;LU CUI-JUN
分类号 H05K7/20;F28D15/00 主分类号 H05K7/20
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