System and methods for implementing a wafer level hermetic interface chip

摘要

Systems and methods for enabling hermetic sealing at the wafer level during fabrication of a microelectromechanical sensor (MEMS) device. The MEMS device has a specialized hermetic interface chip (HIC) that facilitates a stable hermetic sealing process. The HIC includes a plurality of vias (28) in a substrate layer, a plurality of mesas (20) having etched portions, a seal ring, a plurality of conductive leads (24) on a first side of the HIC, and a plurality of conductive leads (30) on a second side of the HIC. The plurality of conductive leads on the first side of the HIC feeds from the etched portions of the plurality of mesas through the plurality of vias in the substrate layer to the plurality of conductive leads on the second side of the HIC. The conductive leads are capable of connecting an external circuit to the MEMS device.