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发明名称
Plattierungsbad und Verfahren zum Abscheiden einer metallischen Schicht auf einem Substrat
摘要
申请公布号
DE60141143(D1)
申请公布日期
2010.03.11
申请号
DE20016041143
申请日期
2001.10.04
申请人
SHIPLEY CO.
发明人
COBLEY, ANDREW J.;KAPECKAS, MARK J.;REDDINGTON, ERIK;SONNENBERG, WADE;BARSTAD, LEON R.;BUCKLEY, THOMAS
分类号
C25D3/02;C25D3/38;C25D7/06;C25D7/12;H05K3/24
主分类号
C25D3/02
代理机构
代理人
主权项
地址
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