| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for which the kind of solder can be determined easily certainly, a device provided with the substrate, a method of manufacturing the substrate, and a determining method. <P>SOLUTION: The substrate 1 includes a base material 11, a first solder part 12 disposed on a surface of the base material 11 and used for connection to an electronic component, and a second solder part 13 disposed on the surface of the base material 11 and formed of the same solder as that of the first solder part 12. The top surface of the first solder part 12 is made to be a flat surface 121, and the maximum height H2 of the second solder part 13 from the surface of the base material 11 is lower than the height H1 of the flat surface 121 of the first solder part 12 from the surface of the base material 11. <P>COPYRIGHT: (C)2010,JPO&INPIT |
