| 摘要 |
<p>Provided is a semiconductor device manufacturing method by which deterioration of reliability of a bonding section is eliminated, a general bump material can be used and manufacturing cost increase can be suppressed, even when a relatively low-cost package carrier having a low softening temperature is used. At the time of bonding a terminal section (12) of a semiconductor chip (10) with a terminal section (22) of a package carrier (20), the semiconductor chip is heated to a temperature where a package carrier base material (21) softens, the terminal section of the heated semiconductor chip is brought into contact with the terminal section of the package carrier, and the package carrier terminal section and the package carrier base material in the peripheral regions of the package carrier terminal section are softened by heat transfer. Then, in a state where the package carrier terminal section and the package carrier base material in the peripheral regions of the package carrier terminal section are softened, the semiconductor chip terminal section is pressed and bonded to the package carrier terminal section, and the package carrier terminal section is brought into a state where the terminal section is pushed inward from the surface of the package carrier base material.</p> |
