| 摘要 |
Methods for attaching microfeature dies to external devices are disclosed. The external devices can include other microfeature dies, support members or other suitable devices. A particular method includes attaching the solder to the at least one of the microfeature die in the support member by changing a phase of the solder. The method can further include contacting the solder with the other of the microfeature die and the support member and urging the microfeature die and the support member toward each other to provide a first bond between the die and the support member via the solder. The method can still further include changing a phase of the solder to provide a second bond between the microfeature die and the support member, with the second bond being stronger than the first bond.
|
