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发明名称
MOLDING APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE
摘要
申请公布号
KR20100000037(U)
申请公布日期
2010.01.06
申请号
KR20080008437U
申请日期
2008.06.24
申请人
发明人
分类号
H01L21/00;H01L21/02;H01L21/56;H01L21/68
主分类号
H01L21/00
代理机构
代理人
主权项
地址
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