| 摘要 |
PROBLEM TO BE SOLVED: To improve the efficiency of operation in a substrate bonding apparatus without requiring increase in capacity of a power source. SOLUTION: The substrate bonding apparatus which bonds a group of laminated substrates by heating and pressing it includes a plurality of heating and pressing sections for heating and pressing the groups and a control section for controlling electric power supplied to the heating and pressing sections. The control section starts the supply of electric power to at least one of the heating and pressing sections at a time point different from a start point of supply of electric power to the other heating and pressing sections. COPYRIGHT: (C)2010,JPO&INPIT |
