发明名称 Light-emitting diode package and light-emitting device
摘要 <p>This invention relates to an LED package for affixing an LED, and to a light-emitting device in which an LED having upper and lower electrodes is affixed to the LED package. The LED package of the present invention comprises a shaped body and at least first and second clips that fit on the shaped body. The bottom portion of the shaped body has at least a first opening and a second opening formed therein. Formed around the first and second openings is a light reflecting portion. The opening of the shaped body has an integrally formed fluorescent film attachment portion to which a fluorescent film member is attached. The first clip has a centrally located LED mounting projection, and ends that resiliently engage with the shaped body. The first clip engages with the shaped body by the ends. The second clip has a connecting projection, and ends that resiliently engage with the shaped body.</p>
申请公布号 EP2112700(A2) 申请公布日期 2009.10.28
申请号 EP20090251163 申请日期 2009.04.23
申请人 C. I. KASEI COMPANY, LIMITED 发明人 FUSHIMI, HIROSHI
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
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