发明名称 |
Chemisch-mechanisches Polierkissen und Polierverfahren |
摘要 |
A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (A) a styrene polymer and (B) a diene polymer. <??>A method for producing the above chemical mechanical polishing pad, the method comprising the steps of preparing a composition comprising (A) a styrene polymer, (B) a diene polymer and (C) a crosslinking agent, shaping the above composition into a predetermined shape, and heating the composition during or after shaping to cure it. <??>A chemical mechanical polishing process which comprises polishing a surface to be polished of an object to be polished by use of the chemical mechanical polishing pad. <??>According to the present invention, it is possible to provide a chemical mechanical polishing pad which can be suitably applied to polishing of metal film and insulation film, particularly to an STI technique, provides a flat polished surface, can provide a high polishing rate and has a satisfactory useful life. |
申请公布号 |
DE602005006326(T2) |
申请公布日期 |
2009.07.09 |
申请号 |
DE20056006326T |
申请日期 |
2005.02.04 |
申请人 |
JSR CORP. |
发明人 |
OKAMOTO, TAKAHIRO;MIYAUCHI, HIROYUKI;KAWAHARA, KOUJI;SHIHO, HIROSHI;HASEGAWA, KOU;KAWAHASHI, NOBUO |
分类号 |
B24B37/04;B24B37/24;B24D13/14;B24D18/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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