METHOD FOR MANUFACTURING OF MULTI-LAYER THIN FILM SUBSTRATE FOR MEMS PROBE CARD

摘要

A method for manufacturing a multi-layer thin film substrate for MEMS probe card is provided to reduce a necessary time for testing semiconductor IC. A method for manufacturing a multi-layer thin film substrate for MEMS probe card comprises the following steps of: preparing an LTCC(low temperature co-fired ceramics) substrate; forming an insulating layer on both sides of the LTCC substrate; forming a base metal layer on the both sides of the LTCC substrate; forming a thin film conductor(6) on the base metal layer; forming a first and second metal bumps(7,8) on the thin film conductor; and forming a plating layer(9) on the second metal bump.