发明名称 Apparatus and method of rinsing and drying semiconductor wafers
摘要 An apparatus for rinsing and drying semiconductor wafers includes a rinsing bath, a drying bath and a drying chamber. The rinsing bath and drying bath are connected by a tunnel unit which prevents semiconductor wafers from being exposed to air while being transferred from the rinsing bath to the drying bath. Thus watermarks are prevented from being formed on the semiconductor wafers. A method for rinsing and drying semiconductor wafers includes rinsing the wafers in a rinsing bath, transferring the wafers to a drying bath through a tunnel unit that prevents the semiconductor wafers from the being exposed to air, and after processing the wafers in the drying bath, transferring the wafers to a drying chamber.
申请公布号 US2009139548(A1) 申请公布日期 2009.06.04
申请号 US20080378565 申请日期 2008.12.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM HONG-SEOK
分类号 B08B3/00;H01L21/304;C23G1/00;H01L21/00;H01L21/02;H01L21/302 主分类号 B08B3/00
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