| 摘要 |
<p>An anisotropically conductive adhesive for use in the anisotropically conductive connection of an electronic part to a wiring board without pressurization or with a low pressure. The adhesive comprises a binder resin composition and conductive particles dispersed therein. The conductive particles comprise a metal flake powder having a major-axis length of 10-40 µm, thickness of 0.5-2 µm, and aspect ratio of 5-50. The content of the conductive particles in the anisotropically conductive adhesive is 5-35 mass%. The anisotropically conductive adhesive is supplied to a connection terminal of a wiring board, and a connection terminal of an electronic part is provisionally connected to that connection terminal of the board which has the anisotropically conductive adhesive supplied thereto. The adhesive is heated without applying a pressure or while applying a low pressure to the electronic part. Thus, the board and the electronic part can be anisotropically conductively connected.</p> |
