Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby

摘要

Methods and associated structures of forming microelectronic devices are described. Those methods may include coating an interconnect structure disposed on a die with a layer of functionalized nanoparticles, wherein the functionalized nanoparticles are dispersed in a solvent, heating the layer of functionalized nanoparticles to drive off a portion of the solvent, and applying an underfill on the coated interconnect structure.