| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrically conductive adhesive easy to produce and improved in adhesive strength without lowering its own electrical conductivity, and to provide electronic components using the same. SOLUTION: The electrically conductive adhesive comprises 2-10 mass% of an epoxy resin liquid at room temperature, 2-10 mass% of a phenolic resin liquid at room temperature, 2-10 mass% of a reactive diluent, 0.05-0.9 mass% of an imidazole compound and 70-90 mass% of electrically conductive metal particles. The electronic components using the adhesive are also provided. COPYRIGHT: (C)2009,JPO&INPIT
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