| 摘要 |
<p>PURPOSE:To reduce a thickness of insulating resin to about half of that of prior art by insulating between a printed circuit board for an outer layer and a printed circuit board for an inner layer. CONSTITUTION:One side surface of a printed circuit board 3a for an inner layer is coated with ultraviolet ray curable liquidlike insulating resin 4, and filmlike ultraviolet ray curable insulating resin 5 is temporarily adhered thereon. Further, the other side surface is similarly processed to form an inner layer intermediate material 7a. Then, an opposite surface of the board 3b to a conductor circuit of one side surface of an insulating board 2b, is coated with the resin 4 to form an outer layer material 7b. Thereafter, two sets of the materials 7b are so mounted at both sides of the material 7a that the circuit 1 is directed outside to form a preprocessing layer component 8. As at least one of the two sets of the materials 7b, the board 2b made of an ultraviolet transmission type material is used. Then, the component 8 is pressed to form a laminated intermediate product 9, and irradiated with an ultraviolet ray to manufacture a multilayer printed circuit board 10. Thus, a thickness can be reduced and insulating characteristics can be improved.</p> |
