| 摘要 |
This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio n<SUB>f</SUB>/n<SUB>r </SUB>(where n<SUB>f </SUB>is the refractive index of the inorganic filler and n<SUB>r </SUB>is the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of -1x10<SUP>-5 </SUP>/° C. to 4x10<SUP>-5</SUP>/° C., and a true dependency value of its refractive index on the temperature of -1x10<SUP>-4</SUP>/° C. to 1x10<SUP>-4</SUP>/° C. in a temperature range from -20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 mum or from 1.2 to 1.6 mum. This invention also provides an optoelectronic circuit board.
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