发明名称 SOLID-STATE IMAGING DEVICE AND INSPECTION METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging device, such that leak currents between pixels which are adjacent in a row direction and a column direction can be detected, using a simple configuration and with high accuracy, and to provide an inspection method therefor. SOLUTION: The solid-state imaging device has a solid-state imaging element unit 10, formed by arraying unit pixel groups EU of two rows by two columns of three or four kinds of photoelectric converting pixels E in a matrix form in row and column directions; a first difference detecting circuit 60 having a first difference detected signal generating circuit A1 which outputs a first difference detection signal indicative of the value in a difference in voltage between a first pixel and a second pixel adjacent to the first pixel in the row direction and a second difference detected signal generating circuit A2 which outputs a second difference detected signal indicative of the value of a difference in voltage between a third pixel adjacent to the second pixel, on the opposite side from the first pixel in the row direction and a pixel adjacent to the third pixel in the row direction; a second difference detecting circuit 70 which outputs a first decision signal, indicative of the difference value between the first difference detection signal and second difference detected signal; and a decision circuit 80, which decides whether the solid-state imaging element unit 10 is proper, by comparing the first decision signal with a predetermined criterion value. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008300905(A) 申请公布日期 2008.12.11
申请号 JP20070141301 申请日期 2007.05.29
申请人 SHARP CORP 发明人 ITAGAKI TAKESHI;SAEKI TAKAHIRO
分类号 H04N9/07;H01L27/14;H01L27/146;H04N17/02 主分类号 H04N9/07
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