| 摘要 |
A CMOS image sensor chip scale package and a method are provided to improve the board level reliability test of the temperature cycling and provide the FO-WLP structure without RDL. An image sensor package structure comprises the substrate(2), the die(16), the dielectric layer(38), the wire bonding(24), the core paste material(50), and the transparent cover. The substrate has the die through hole(10) and the contact point through hole(6) formed through the substrate. The terminal pads are formed under the contact point through-hole structure. The contact pads are formed on the top surface of the substrate. Die has the micro lens domain arranged within the die through hole. The wire bonding is formed in die and top of the substrate and is combined with the die and the contact pad. The core paste material is formed in the gap between the side wall of the die through hole and the die edge. The transparent cover is arranged by adhesion on the die and the dielectric layer in order to form a gap. |
