Imaging element package, imaging element module and lens barrel, and image capturing apparatus

摘要

An imaging element package includes: an imaging element chip having an imaging surface; a substrate on which the imaging element chip mounted; an optical member that allows light to pass; and a supporting body having a body portion where a through-opening serving as a light path for imaging is formed, and an attachment portion that is provided in the body portion and is to be attached to an attachment position. The substrate is attached to the body portion so as to close one end of the opening in a through direction in a state where the imaging surface faces another end from the one end of the opening in the through direction, and the optical member is attached to the body portion so as to close the another end of the opening in the through direction.