| 摘要 |
A molding film and a semiconductor package having the same are provided to perform the process of molding the semiconductor chip and the process of electrically connecting the pad of semiconductor package substrate and the pad of semiconductor chip at the same time. The film for the semiconductor package molding includes the protection unit(11) for protecting the semiconductor chip from outside; the electrical connection(13) which electrically connects the pad of the semiconductor chip and the pad of substrate; the adhesive part(15) adhering the protection unit to the substrate. The electrical connection is formed on the one side of the protection unit. The adhesive part is formed on the one side of the protection unit except for the region in which the electrical connection is formed.
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