发明名称 Spray cooling system
摘要 <p>A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.</p>
申请公布号 EP1991041(A2) 申请公布日期 2008.11.12
申请号 EP20080015219 申请日期 2000.09.13
申请人 HEWLETT-PACKARD COMPANY 发明人 PATEL, CHANDRAKANT D.;BASH, CULLEN
分类号 F25D17/02;H05K7/20;F25B39/02;F25B39/04;F25D9/00;H01L23/427;H01L23/473 主分类号 F25D17/02
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