| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that an abnormal sound is generated by the mechanical vibration of an electronic component or vibration upon transportation or the like caused by the contact of a lead wire with the electronic component or the substrate since a part coated by a vinyl coating or a part covered with solder is harder than the other part and vibration is concentrated at a part which is not coated by the coating and the solder is not adhered thereto. SOLUTION: Soldering is carried out so that a place except a part where an electrode part of the electronic component is soldered to the lead wire and an electrode part of the substrate is soldered to the lead wire may not contact with the electronic component or the substrate while elastic adhesive agents are applied on a part between the electronic component and the lead wire, and a part between the substrate and the lead wire. COPYRIGHT: (C)2009,JPO&INPIT |
