| 摘要 |
A semiconductor wafer and a cutting method thereof are provided to release mechanical impact transferred to ridges by forming posts between the ridges along a ridge line. A semiconductor wafer comprises a substrate(31), a metal electrode(32), a ridge(33), and a post(34). A nitride based compound semiconductor is grown on the substrate. The metal electrode injects electric current to a laser diode on the substrate. The ridge projects laser lights. The post is installed between the ridge lines. The post is formed higher than ridge. The posts are installed alternately along a cleaving line(35).
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