发明名称 |
STACKABLE LEADLESS ELECTRONIC PACKAGE |
摘要 |
An electronics package is described in which a quad flat no lead (QFN) electronic package has top and bottom surfaces. The bottom surface includes bottom contact pads arranged in a first pattern for electrical connection to corresponding package contact pads of an underlying circuit structure. The top surface includes top contact pads arranged in a second pattern for electrical connection to corresponding bottom contact pads of an overlying electronic package. |
申请公布号 |
WO2008091474(A3) |
申请公布日期 |
2008.10.02 |
申请号 |
WO2007US89003 |
申请日期 |
2007.12.28 |
申请人 |
ANALOG DEVICES, INC.;GOIDA, THOMAS, M. |
发明人 |
GOIDA, THOMAS, M. |
分类号 |
H01L23/31;H01L23/495;H01L25/10 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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