发明名称 |
Optoelectronic device packaging assemblies and methods of making the same |
摘要 |
Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.
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申请公布号 |
US7427524(B2) |
申请公布日期 |
2008.09.23 |
申请号 |
US20050202596 |
申请日期 |
2005.08.11 |
申请人 |
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) |
发明人 |
MCCOLLOCH LAWRENCE R.;MATTHEWS JAMES A.;WILSON ROBERT E.;BAUGH BRENTON A. |
分类号 |
H01L33/00;G02B6/42;H01S5/00;H01S5/02;H01S5/022;H01S5/024;H01S5/042;H01S5/40 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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