| 摘要 |
A ball grid array includes: a semiconductor chip (2) having multiple pads (20); and an interposer (1) for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings (7) on the first surface and multiple ball terminals (5) on a second surface opposite to the first surface. Each wiring is connected to a corresponding pad of the semiconductor chip, and is electrically connected to a corresponding ball terminal. At least one of ball terminals providing a power supply terminal or a ground terminal provides a common ball terminal for connecting to at least two of the pads of the semiconductor chip through two wirings. |
