发明名称 |
Stress Mitigation in Packaged Microchips |
摘要 |
A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus. |
申请公布号 |
US2008157298(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20070770369 |
申请日期 |
2007.06.28 |
申请人 |
ANALOG DEVICES, INC. |
发明人 |
ZHANG XIN;JUDY MICHAEL;CHAU KEVIN H.L.;KUAN NELSON;SPOONER TIMOTHY;PAYDENKAR CHETAN;FARRELL PETER |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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