| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light-emitting element which can prevent a melting of a reflection layer and the like and a damage of a substrate and/or semiconductor layer when the semiconductor light-emitting element formed with an optical reflection face on a back face of the substrate is scribed from the back side, and can manufacture the high performance semiconductor light-emitting element handily and easily without causing an increase of a production cost. <P>SOLUTION: The method for manufacturing the semiconductor light-emitting element comprises the steps of: forming a semiconductor layer on a first main face of the substrate to provide a light-emitting element structure; providing a laminate structure containing the reflection layer on a second main face of the substrate; removing a part of an upper layer of the laminate structure to define the upper layer in a predetermined shape; and removing a part of a lower layer exposed as described above to expose the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
