| 摘要 |
An electroless gold plating bath which can secure deposition rate stably and satisfactorily and does not cause flaws in external appearance when forming a thick film is provided, an electroless gold plating method using the electroless gold plating bath is provided, and electronic parts subjected to electroless gold plating by the method are provided. An electroless gold plating bath comprises a water-soluble gold compound, a complex agent, an aldehyde compound, and an amine compound represented by the general formula (1) of R1-NH-C2H4-NH-R2 or the general formula (2) of R3-(CH2-NH-C2H4-NH-CH2)n-R4, where R1, R2, R3 and R4 represent -OH, -CH3, -CH2OH, -C2H4OH, -CH2N(CH3)2, -CH2NH(CH2OH), -CH2NH(C2H4OH), -C2H4NH(CH2OH), -C2H4NH(C2H4OH), -CH2N(CH2OH)2, -CH2N(C2H4OH)2, -C2H4N(CH2OH)2 or -C2H4N(C2H4OH)2 and may be identical to one another or different from one another, and n is an integer of 1 to 4. The aldehyde compound and the amine compound have a content molar ratio such that aldehyde compound:amine compound=1:30 to 3:1. The water-soluble gold compound is a gold cyanide salt.
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