| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component which can detect internal crack simply without destroying the electronic component, while improving the manufacturing yield. <P>SOLUTION: The manufacturing method for an electronic component includes a crack inspection step for inspecting any crack in a material being tested 7 with a structure in which a terminal electrode is formed on a nearly cuboid-shaped laminated body comprising stacked dielectric layer and electrode layer. The crack inspection step comprises a step for measuring the amount of displacement in the lamination direction in a predetermined position on the top surface of the material being tested 7 while applying the voltage onto the material being tested 7, a step for preparing a reference electronic component and for measuring the amount of displacement in the lamination direction in a position of the reference electronic component corresponding to the measurement position of the material being tested 7 while applying the voltage onto the reference electronic component under the same condition as the material being tested 7, and a step which determines presence or absence of crack for screening by comparing the amount of displacement of the material being tested 7 and the reference electronic component. <P>COPYRIGHT: (C)2008,JPO&INPIT |
